Rubber Bonding 1998

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In recent years the bonding of rubber to various substrates has undergone a number of radical changes. Many of these changes have been legislative driven, in an effort to reduce the amount of solvents being passed to the atmosphere.

To collate new research, Rapra Technology and European Rubber Journal, brought together experts from many European countries to discuss the issues involved in modern rubber bonding processes. The current and prospective technological platforms for progress within the field of bonding rubber to substrates were the main issues of the conference.

The 20 papers (as detailed below) from the meeting have been assembled to provide a comprehensive record of this highly successful seminar.

  • Theoretical Aspects of Adhesion
  • Bonding Agents - Practical Solutions for the Future Techniques for Bonding Rubber to Metal Using Metallic Coagents
  • Recent Developments in Cobalt Adhesion Promoters
  • Progress in Rubber to Substrate Bonding
  • Life Prediction for Rubber/Metal Bonds: The role of elevated Temperature in Accelerated Testing
  • Adhesives for the New Millennium
  • Factors Affecting Rubber to Metal Bond Strength and Failure Mode
  • Non-Destructive Testing (NDT) of Rubber Bonding Materials
  • Development of Rubber Metal Bonding Agents During the Last 25 years
  • Pretreatments to Enhance the Adhesion to Elastomers
  • Biological Monitoring for Solvents: New Developments
  • Environmentally Friendly Cryogenic Solvent Recovery
  • Substrate Preparation for Bonding
  • Bonding of Fluoroelastomers to Various Substrates
  • Aramid Fibers and New Adhesion Systems to Elastomers Hans Janssen, Akzo Nobel Aramid Products, The Netherlands
  • Bonding Elastomers to Plastics
  • The Influence of Moulding Temperature on the strength of Natural Rubber to Metal Bonded Joints
  • Studies in Rubber to Metal Adhesion
  • Bonding of Surface Protection Materials made from Rubber on Metallic Substrates

  • ISBN:
    978-1-85957-151-4
    Pages:
    236
    Publisher:
    Rapra Conference Proceedings, 1998
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